Manganese implanted Germanium: from clustering to carrier-mediated ferromagnetism
oral presentation: 2010-08-24 09:30 AM – 09:50 AM
Last modified: 2010-07-15
Abstract
Mn doped Ge (Ge:Mn) is a promising candidate for a ferromagnetic semiconductor compatible with silicon technology, since Mn acts as a magnetic ion as well as a double acceptor in Ge. Whereas ferromagnetism has been evidenced by magnetization measurements in Ge:Mn, the transport behavior is entirely different from the GaAs:Mn system [1], the prototype of a ferromagnetic semiconductor.
We have prepared a series of Ge:Mn layer by Mn ion implantation into near-intrinsic Ge substrates, at 350 °C (resulting in Mn5Ge3 clusters) and -40 °C (without precipitates) [1-4]. The Mn concentration ranges from 0.004% to 10%. For samples with 10% Mn, flash lamp and pulsed laser annealing (PLA) has been applied. We obtained three kinds of samples: (1) very dilute Ge:Mn where no ferromagnetic coupling can be expected [1]; (2) nanocrystalline Mn5Ge3 embedded inside the Ge matrix [2]; and (3) diluted Ge:Mn together with Mn-rich spinodal phases [3]. Indeed all samples show p-type conductivity with a hole concentration ranging from 1018 to 1020 cm-3. The highest concentrations above 1020 cm-3 can only be achieved by PLA. In the sample with the largest hole concentration of 2.1×1020 cm-3, we observed a one-to-one correspondence between the hysteresis in magnetization, magnetoresistance and Hall resistance below 10 K [3, 4]. We argue that the hole concentration is the critical parameter to establish carrier mediated ferromagnetism in Ge:Mn [4]. In addition to the compatibility to Si technology, ion implantation followed by PLA is an established scalable chip technology and may have a significant industry impact.
[1] S. Zhou et al., APL, 95, 172103 (2009).
[2] S. Zhou et al., APL, 95, 192505 (2009).
[3] S. Zhou et al., PRB 81, 165204 (2010).
[4] S. Zhou et al., APL, in press (2010).Author(s) affiliation:
Danilo Buerger, Institute of Ion Beam Physics and Materials Research, Forschungszentrum Dresden-Rossendorf, Germany
Wolfgang Skorupa*, Institute of Ion Beam Physics and Materials Research, Forschungszentrum Dresden-Rossendorf, Germany
Carsten Timm, Institute for Theoretical Physics, Technical University Dresden, Germany
Peter Oesterlin, INNOVAVENT GmbH, Germany
Manfred Helm, Institute of Ion Beam Physics and Materials Research, Forschungszentrum Dresden-Rossendorf, Germany
Heidemarie Schmidt, Institute of Ion Beam Physics and Materials Research, Forschungszentrum Dresden-Rossendorf, Germany
*presenting author